Home / Hardware design / How to fanout DDR3 Memory from CPU

How to fanout DDR3 Memory from CPU

I was very happy to write a post for Altium. Read the full article at the Altium blog here >>

Do you plan ahead when working on CPU DDR3 fanout?

Choosing the correct VIA for a particular memory group and deciding on how PCB layers will be used can make DDR3 layout a lot easier. Assigning different colors to each memory group help visualize the interface.

Why to use uVIAs instead of through hole VIAs for Address, Command and Control signals?

The Address, Command and Control group has the highest number of signals from the memory groups. If we chose through hole VIAs, we would use a lot of space on all the layers. By choosing uVIAs, we only need the space on the Layer 3 and because uVIA is smaller in diameter, we also have more space to fanout the signals on Layer 3.

Read the full article here >>


Learn Advanced PCB Layout ONLINE

You will learn how to do Advanced PCB Layout (DDR3, PCIE, SATA, Ethernet, etc.).

How to register for this online course?

Step 1: Register & Login at FEDEVEL Academy website – Click here
Step 2: Select your course (you will need to be logged in) – Click here

Find out more about this course in this short introduction video


Learn Advanced Hardware Design ONLINE
Starting next week. Don’t miss. Register here >>
Special offer THIS WEEK ONLY: Sign up for Advanced Hardware Design Course and Get FREE Altium Essentials Online Course Register here >>

This course will show you how you can design boards more effectively and produce professional results. It provides you tips and tricks to help you to design boards that work the first time.

The course is practically based and will teach you everything by actually doing it. Anyone who is interested can work on his/her own project during the course. By the end of the course you will have learnt how to create professional manufacturing output which you can then use to build your own board.

How to register for this online course?

Step 1: Register & Login at FEDEVEL Academy website – Click here
Step 2: Select your course (you will need to be logged in) – Click here

Find out more about this course in this short (2 minutes) introduction video

Check Also

098fi

TIP #098: Don’t forget to place other mounting holes (e.g. for heatsink)

Why? It may be very difficult to add mounting holes into already routed area. Note: …

  • Brad

    You use stacked micro-vias then? Am I correct to assume that your next layer from the top would be a ground plane? If it is, you must have to drop down two layers to get so your next signal plane, yes?

    • http://www.fedevel.com Robert Feranec

      Hi Brad,
      – no stacked microvias.
      – yes, the L2 is GND. I used L1-L2 and L2-L3 uVIAs connected on the Layer 2 with very short tracks.